White Paper
Reduce 3D IC Design Complexity with Early Package Assembly Verification
2.5D and 3D ICs present unique challenges to physical verification. This happens mainly because of their composition. They are often composed of multiple chiplets of different materials integrated into all three dimensions.
However, there’s a solution that can help 3D IC designers optimize designs and carry out physical verification earlier in the flow.
Explore the white paper to learn how this approach can help achieve a range of benefits, including:
- Optimized floor planning
- Reduced verification runs
- Simplified debugging
- Minimized iterations
Sponsored by: Siemens